New Chip
 |
|
The internal parts of a suspected next-generation iPhone. [Photo/9to5mac.com] |
According to 9to5mac.com, one of the main upgrades to the next iPhone's internal parts will be a redesigned wireless system featuring a new Qualcomm-made LTE chip.
"The new device will include Qualcomm's MDM9635M chip, also known as the '9X35' Gobi modem platform," said the report.
This new chip promises significant performance improvements over the "9X25″ chip found inside the current iPhone 6 and iPhone 6 Plus, capable of delivering up to twice the theoretical LTE download speeds.
Copyright 1995 - . All rights reserved. The content (including but not limited to text, photo, multimedia information, etc) published in this site belongs to China Daily Information Co (CDIC). Without written authorization from CDIC, such content shall not be republished or used in any form. Note: Browsers with 1024*768 or higher resolution are suggested for this site.
License for publishing multimedia online 0108263 Registration Number: 130349 
